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 Low Profile ClampTM 8-Line ESD protection
PROTECTION PRODUCTS - MicroClampTM Description
The Clamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. TVS diodes offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The ClampTM0508T is in a 8-pin, RoHS/WEEE compliant, SLP1713P8T package. It measures 1.7 x 1.3 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.4mm and are finished with leadfree NiPdAu. Each device features eight TVS diodes with an operating voltage of 5 volts and a maximum loading capacitance of only 10pF. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and notebook computers.
TM
UCLAMP0508T
Features
Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package Protects eight data lines Low clamping voltage Working voltage: 5V Low capacitance (10pF) Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP1713P8T package RoHS/WEEE Compliant Nominal Dimensions: 1.7 x 1.3 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories Notebooks & Handhelds Micro SD Ports MMC & HS-MMC Ports Portable Instrumentation Digital Cameras Peripherals
Dimensions
1.70
123 4
Schematic
1
2
3
4
5
6
7
8
1.30
8 7 6
0.40 BSC
Tab
5
0.40
Nominal Dimensions (mm) (SLP1713P8T Bottom View)
Revision 01/07/2008 1 www.semtech.com
UCLAMP0508T
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Power (tp = 8/20s) Maximum Peak Pulse Current (tp = 8/20s) ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Pp k Ip p VESD TJ TSTG Value 25 2 +/- 20 +/- 15 -55 to +125 -55 to +150 Units Watts Amps kV C C
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Forward Voltage Clamp ing Voltage Junction Cap acitance Junction Cap acitance Symbol VRWM V BR IR VF VC Cj Cj It = 1mA VRWM = 5V, T=25C IF = 10mA IPP = 2A, tp = 8/20s VR = 0V, f = 1MHz VR = 3.3V, f = 1MHz 4.5 1 6 0.25 1.2 12.5 10 Conditions Minimum Typical Maximum 5 Units V V A V V pF pF
(c) 2008 Semtech Corp.
2
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UCLAMP0508T
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
Power Derating Curve
110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0
Peak Pulse Power - PPP (kW)
1
0.1
0.01 0.1 1 10 100 Pulse Duration - tp (us)
0
25
50
75
100
o
125
150
Ambient Temperature - TA ( C)
Clamping Voltage vs. Peak Pulse Current
15 8 7 Clamping Voltage - VC (V) Forward Voltage - VF V) 6 5 4 3 2 1 0 0 0.5 1 1.5 2 2.5 3 0 1
Forward Voltage vs. Forward Current
10
5
Waveform Parameters: tr = 8s td = 20s
Waveform Parameters: tr = 8s td = 20s
0 Peak Pulse Current - IPP (A)
2
3
4
5
6
7
8
9
10
11
12
13
14
Forward Current - IF (A)
Junction Capacitance vs. Reverse Voltage
ESD Clamping (8kV Contact per IEC 61000-4-2)
1.1 1 0.9 0.8 CJ(VR) / CJ(VR=0) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 f = 1 MHz
Note: Data is taken with a 10x attenuator (c) 2008 Semtech Corp. 3 www.semtech.com
UCLAMP0508T
PROTECTION PRODUCTS Typical Characteristics
Insertion Loss S21
CH1 S21 LOG 6 dB / REF 0 dB 1: -3.0037dB 572.149 MHz 2: -5.0581 dB 800.00 MHz
1 2 3
Analog Crosstalk
CH1 S21 LOG 20 dB / REF 0 dB
0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB
4
3: -5.8299 dB 900.00 MHz
5
4: -23.207 1.80000 GHz 5: -13.452 2.50000 GHz
1 MHz START. 030 MHz
10 MHz
100 MHz
3 1 GHz GHz . STOP 3000 000000 MHz
START. 030 MHz . STOP 3000 000000 MHz
(c) 2008 Semtech Corp.
4
www.semtech.com
UCLAMP0508T
PROTECTION PRODUCTS Applications Information
Device Connection Options This device is designed to protect eight data lines. The device is unidirectional and may be used on lines where the signal polarity is above ground. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering and ESD performance of the device. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Figure 2 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spacedapproximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Figure 2 - Recommended Layout using Ground Vias Figure 1 - Circuit Diagram (Eight Each)
(c) 2008 Semtech Corp.
5
www.semtech.com
UCLAMP0508T
PROTECTION PRODUCTS Applications Information - Spice Model
UCLAMP0508T Spice Model
UCLAMP0508T Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 2.05e-15 7.0 0.80 0.75 1.0E-3 9e-12 2.541E-9 0.25 1.1 1.11
(c) 2008 Semtech Corp.
6
www.semtech.com
UCLAMP0508T
PROTECTION PRODUCTS Outline Drawing - SLP1713P8T
A D B
DIM
PIN 1 INDICATOR (LASER MARK) E
A aaa C A2 A1 C
SEATING PLANE
A A1 A2 b D D1 E E1 e L N aaa bbb
.015 .016 .017 .000 .001 .002 (.005) .006 .008 .010 .065 .067 .070 .047 .051 .055 .049 .051 .054 .008 .012 .016 .016 BSC .008 .010 .012 8 .003 .004
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.78 1.20 1.30 1.40 1.25 1.30 1.38 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 8 0.08 0.10
D1 1 E1 N e/2 e D/2 2 LxN E/2
bxN bbb CAB
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1713P8T
P
X
DIM C G H K P X Y Z
DIMENSIONS INCHES (.050) .027 .012 .055 .016 .008 .023 .073 MILLIMETERS (1.27) 0.69 0.30 1.40 0.40 0.20 0.58 1.85
Z
G Y K
H (C)
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE.
(c) 2008 Semtech Corp.
7
www.semtech.com
UCLAMP0508T
PROTECTION PRODUCTS Marking Code Ordering Information
Part Number uClamp 0508T.TCT Working Voltage 5V Qty per Reel 3,000 Reel Size 7 Inch
PIN 1 INDICATOR
0508T
YYWW
Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and Clamp are marks of Semtech Corporation
Note: YYWW = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0 1.51 +/-0.10 mm
Tape Width
B0 1.91 +/-0.10 mm
K0 0.66 +/-0.10 mm
K (MAX)
B, (Max)
D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000)
D1
E 1.750.10 mm (.069.004)
F
P 4.00.1 mm (.157.004)
P0 4.00.1 mm (.157.004)
P2
T(MAX)
W 8.0 mm + 0.3 mm - 0.1 mm (.312.012)
8 mm
4.2 mm (.165)
0.8 mm 0.05 (.031)
3.50.05 mm (.138.002)
2.4 mm (.094)
2.00.05mm (.079.002)
0.4 mm (.016)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
(c) 2008 Semtech Corp.
8


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